Thermal Pads

A complete kit to test and measure the thermal resistance of various materials.

Ultra-thin films that enhance thermal interface performance in space-constrained applications.

A thermal compound featuring zinc oxide for superior conductivity and stability.

Advanced composite materials designed to enhance thermal conductivity in various applications.

Pads designed to provide both electrical conductivity and effective thermal transfer.

Ideal for flat surfaces, this material enhances contact and improves thermal coupling.

Made from high-purity graphite, these pads offer excellent thermal conductivity and flexibility.

Designed for CPUs and GPUs, this thermal paste ensures optimal heat transfer.

A heat-resistant tape suitable for use in high-temperature environments.

A high thermal conductivity paste made from liquid metal for extreme cooling performance.

Thermal materials made from metals for superior heat transfer in high-performance applications.

Materials that change phase at certain temperatures, optimizing thermal management in devices.

A silicone-based thermal grease providing high thermal conductivity and stability under extreme conditions.

A high-temperature adhesive with thermal conductivity for mounting heatsinks or other heat-dissipating components.

Epoxy resin that provides excellent thermal conductivity for bonding and filling applications.

Shielding materials that protect sensitive components while providing thermal management.

An instrument designed to measure the thermal conductivity of various materials.

A device to quantify thermal contact resistance for better thermal management.

A high-performance thermal grease designed for efficient heat transfer between surfaces.

Foam materials designed to provide thermal insulation while allowing for some heat transfer.

A specialized coating applied to surfaces to improve thermal contact and heat dissipation.

A gel-like interface material that enhances heat transfer while remaining easy to apply.

A collection of various thermal interface materials for testing and evaluation.

A double-sided thermal tape for easy attachment of heatsinks and other components.

A complete system for efficient thermal management in electronic applications.